From September 25 to 27, the 2024 Integrated Circuit (Wuxi) Innovation and Development Conference and the Annual Meeting of the Semiconductor Equipment Industry of the China Semiconductor Equipment Industry Association were held in Wuxi. Ma Xin, Member of the Standing Committee of the CPC Jiangsu Provincial Committee and Executive Vice Governor of Jiangsu Province, attended and delivered a speech. Zhu Aixun, Director of the Jiangsu Provincial Department of Industry and Information Technology; Zhao Jianjun, Mayor of Wuxi; and Wang Shijiang, Deputy Director-General of the Electronic Information Department of the Ministry of Industry and Information Technology also attended the opening ceremony and jointly inaugurated the conference. At the opening ceremony, the 2024 global and China semiconductor equipment industry reports were released. Forty-five key industrial projects with a total value of nearly RMB 25 billion were signed. The photonic chip pilot line of the Wuxi Institute of Photonics for Integrated Circuits at Shanghai Jiao Tong University, the Southeast University Micro-Nano System International Innovation Center, the Jiangsu Wuxi Integrated Circuit Industry Special Parent Fund, and the Wuxi Semiconductor Equipment and Key Components Innovation Center were launched or inaugurated. Dai Bowei, Director of the Institute of Microelectronics of the Chinese Academy of Sciences; Wang Hui, Chairman of AMEC; Meng Pu, Chairman of Qualcomm China; and Cai Shujun, Director of the 58th Research Institute of China Electronics Technology Group Corporation delivered精彩 speeches and shared insights on the full industry chain development of integrated circuit design, manufacturing, packaging and testing, and equipment.
Hosted jointly by the Wuxi Municipal People’s Government and the Jiangsu Provincial Department of Industry and Information Technology, the conference was themed “A Vibrant IC Ecosystem, Wuxi’s Unique Magnetism.” It featured one opening ceremony, one symposium, three thematic exhibitions, eight series of events, and 15 ecosystem-related activities. Focusing on domestic equipment, AI computing power, automotive electronics, intelligent ecosystems, advanced packaging and testing, and other fields, the conference promoted multi-dimensional and diversified exchanges and aimed to build a first-class domestic and internationally renowned platform for technical exchange and cooperation in the integrated circuit industry, a platform for industry trend releases, a platform for high-end talent aggregation, a platform for coordinated ecosystem development, and a platform for investment and financing services.
